Printed circuit board

Uniform copper deposition, reliable via filling ability, elimination of surface roughness and high additive consumption make use of De Nora DT® anodes: our  solution for today’s challenge.

De Nora DT® anodes are offered in standard and custom design to ensure optimum performance:

• Stable anode area providing uniform plating distribution and better via filling power;
• Extremely low additive consumption and long service lifetime;
• Improved plating bath life and performance by reducing additive by-products
• Elimination of tedious anode maintenance;
• Increased equipment uptime/capacity at high current density operation; 

De Nora also provides:

• Total anode solution in combination with relevant additives and copper replenishment
• Full scale engineering service for upgrading from soluble to insoluble process
• Optimal anode configuration for existing plating line
• Technical support in troubleshooting